|
Processor
|
Processor cores
|
16
|
Processor frequency
|
2.1 GHz
|
Processor cache
|
22 MB
|
Processor lithography
|
14 nm
|
Processor codename
|
Cascade Lake
|
Processor family
|
Intel Xeon Silver
|
Box
|
N
|
Processor socket
|
LGA 3647
|
Processor ARK ID
|
193394
|
Cooler included
|
N
|
Processor model
|
4216
|
Processor threads
|
32
|
Processor operating modes
|
64-bit
|
Processor boost frequency
|
3.2 GHz
|
Component for
|
Server/Workstation
|
|
Technical details
|
Vendor
|
Intel
|
Product type
|
Processor
|
Status
|
Launched
|
Launch date
|
Q2'19
|
Memory speed (max)
|
2400 MHz
|
Number of UPI links
|
2
|
|
Weight & dimensions
|
Processor package size
|
76.0 x 56.5 mm
|
|
Graphics
|
Discrete graphics card
|
N
|
On-board graphics card model
|
Not available
|
Discrete graphics card model
|
Not available
|
On-board graphics card
|
N
|
|
Processor special features
|
Intel® AES New Instructions (Intel® AES-NI)
|
Y
|
Enhanced Intel SpeedStep Technology
|
Y
|
Intel Trusted Execution Technology
|
Y
|
Intel VT-x with Extended Page Tables (EPT)
|
Y
|
Intel TSX-NI
|
Y
|
Intel 64
|
Y
|
Intel Virtualization Technology for Directed I (O (VT-d))
|
Y
|
Intel Virtualization Technology (VT-x)
|
Y
|
Intel Turbo Boost Max Technology 3.0
|
N
|
Intel® Speed Shift Technology
|
Y
|
AVX-512 Fused Multiply-Add (FMA) units
|
1
|
Intel® Resource Director Technology (Intel® RDT)
|
Y
|
Intel® Run Sure Technology
|
N
|
Mode-based Execute Control (MBE)
|
Y
|
Intel® Deep Learning Boost (Intel® DL Boost) on CPU
|
Y
|
Intel® Speed Select technology - Performance Profile (Intel® SST-PP)
|
N
|
Intel® Speed Select technology - Base Frequency
|
N
|
Intel® Volume Management Device (VMD)
|
Y
|
Intel® Optane™ DC Persistent Memory Supported
|
N
|
Intel® vPro™ Technology
|
Y
|
Intel® Hyper Threading Technology (Intel® HT Technology)
|
Y
|
Intel® Turbo Boost Technology
|
2.0
|
|
Features
|
Execute Disable Bit
|
Y
|
Scalability
|
2S
|
Embedded options available
|
Y
|
Maximum number of PCI Express lanes
|
48
|
Supported instruction sets
|
AVX-512
|
PCI Express slots version
|
3.0
|
|
Power
|
Thermal Design Power (TDP)
|
100 W
|
|
Operational conditions
|
Tcase
|
79 °C
|
|
Memory
|
Maximum internal memory supported by processor
|
1024 GB
|
Memory types supported by processor
|
DDR4-SDRAM
|
Memory clock speeds supported by processor
|
2400 MHz
|
Memory channels supported by processor
|
Hexa
|
ECC supported by processor
|
Y
|