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Processor
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|
Processor cores
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14
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Processor frequency
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3.3 GHz
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Processor cache
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19.25 MB
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Processor lithography
|
14 nm
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Processor codename
|
Cascade Lake
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Processor family
|
Intel® Core™ i9 X-series
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Box
|
Y
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Processor socket
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LGA 2066
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Processor ARK ID
|
198014
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Cooler included
|
N
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|
Generation
|
10th Generation
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Processor model
|
i9-10940X
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Processor threads
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28
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Processor operating modes
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64-bit
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Processor boost frequency
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4.6 GHz
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Component for
|
PC
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|
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Technical details
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Vendor
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Intel
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Product type
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Processor
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|
Status
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Launched
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|
Launch date
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Q4'19
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Maximum memory
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256 GB
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|
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Graphics
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Discrete graphics card
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N
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On-board graphics card model
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Not available
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Discrete graphics card model
|
Not available
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On-board graphics card
|
N
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|
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Processor special features
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Intel® AES New Instructions (Intel® AES-NI)
|
Y
|
|
Enhanced Intel SpeedStep Technology
|
Y
|
|
Intel 64
|
Y
|
|
Intel Virtualization Technology for Directed I (O (VT-d))
|
Y
|
|
Intel Virtualization Technology (VT-x)
|
Y
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|
Intel Turbo Boost Max Technology 3.0
|
Y
|
|
Intel® Optane™ Memory Ready
|
Y
|
|
AVX-512 Fused Multiply-Add (FMA) units
|
2
|
|
Intel® Deep Learning Boost
|
Y
|
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Intel® Deep Learning Boost (Intel® DL Boost) on CPU
|
Y
|
|
Intel® Hyper Threading Technology (Intel® HT Technology)
|
Y
|
|
Intel® Turbo Boost Technology
|
2.0
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|
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Features
|
|
Execute Disable Bit
|
Y
|
|
Scalability
|
1S
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|
CPU configuration (max)
|
1
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|
Embedded options available
|
N
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Thermal solution specification
|
PCG 2017X
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|
Maximum number of PCI Express lanes
|
48
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Harmonized System (HS) code
|
8542310001
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|
Supported instruction sets
|
SSE4.1,SSE4.2,AVX 2.0,AVX-512
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|
PCI Express CEM revision
|
3.0
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PCI Express slots version
|
3.0
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|
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Power
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Thermal Design Power (TDP)
|
165 W
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|
|
Operational conditions
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|
Tjunction
|
86 °C
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|
|
Memory
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|
ECC
|
N
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Maximum internal memory supported by processor
|
256 GB
|
|
Memory types supported by processor
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DDR4-SDRAM
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|
Memory clock speeds supported by processor
|
2933 MHz
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Memory channels
|
Quad
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